Application of modified silica powder

Silica powder is a very important inorganic non-metallic functional filler that can be compounded with organic polymers and improve the overall performance of composite materials. It is widely used in electrical and electronic, silicone rubber, coatings, adhesives, potting materials and other fields.

Silica powder itself is a polar, hydrophilic substance. It has different interface properties from the polymer matrix, poor compatibility, and is often difficult to disperse in the base material. Therefore, in order to make the composite material more excellent, it is usually necessary to modify the surface of silica powder and purposefully change the physical and chemical properties of the surface of silica powder according to the needs of the application, so as to improve its compatibility with organic polymer materials and meet its dispersion and fluidity requirements in polymer materials.

Copper clad laminate

Copper clad laminate is an electronic basic material made by impregnating glass fiber or other reinforcing materials with a resin matrix, adding different fillers, and covering one or both sides with copper foil through processes such as glue adjustment and impregnation, and then hot pressing. The addition of modified silica powder can reduce the production cost of copper clad laminates and improve their heat resistance, conductivity and mechanical properties.

Rubber

Rubber is a highly elastic polymer material with reversible deformation. It can be widely used in electronics, automobiles, civil engineering, national defense, medical and health, and daily necessities. In the process of rubber preparation, adding a certain amount of inorganic filler can not only reduce the production cost of rubber, but also significantly improve the comprehensive physical properties and dynamic mechanical properties of rubber composite materials.

Plastic

Silicon powder can be used as a filler in materials such as polyethylene (PE), polyvinyl chloride (PVC), polypropylene (PP), polyphenylene ether (PPO) in the process of making plastics. It is widely used in many fields such as construction, automobiles, electronic communication insulation materials, agriculture, daily necessities, national defense and military.

Epoxy molding compound

Epoxy molding compound is a molding compound made of a variety of additives. It is a key material for electronic packaging and accounts for more than 97% of the market for microelectronic packaging. It can be widely used in semiconductors, consumer electronics, integrated circuits, aviation, military and other packaging fields.

Epoxy casting

Epoxy insulation casting material is a liquid or viscous polymerizable resin mixture made of resin, curing agent, filler, etc. At the pouring temperature, the castable has good fluidity and less volatiles, fast curing, and small shrinkage after curing. The epoxy resin formed after the castable is an insulating product that integrates multiple functions such as insulation, moisture-proof, mildew-proof, anti-corrosion, fixation and isolation.

Electronic potting glue

Potting glue is often used in electronic components, mainly for bonding, sealing, barrier and protection. It is liquid before curing and has a certain fluidity. The viscosity of the glue varies according to the material, performance and production process of the product, and its use value can only be realized after the glue is completely cured.

Artificial quartz stone

Silicon powder is used as a filler in artificial quartz stone, which can not only reduce the consumption of unsaturated resin, but also improve the wear resistance, acid and alkali resistance, mechanical strength and other properties of artificial quartz plate.

Different application fields of silicon micropowder have different quality requirements. Therefore, when choosing the application of silicon micropowder, it should be combined with the needs of downstream industries, and comprehensive cost, efficiency, performance and other factors should be considered to select the appropriate silicon micropowder type and modifier and formula. With the continuous improvement of my country’s economy and society, at present, the application research of modified silicon micropowder will mainly focus on high-end copper clad laminates, high-performance adhesives, insulation materials and other high-tech fields produced with spherical silicon micropowder as raw materials. Refinement and functional specialization will be the mainstream direction of modified silicon micropowder application in the future.