Diamond related applications in the semiconductor industry chain
As we all know, semiconductors are the core strategic technology of many electronic devices and systems. Innovations in semiconductor design and manufacturing are driving new disruptive technologies: 5G, Internet of Things, artificial intelligence, electric vehicles, advanced defense and security capabilities.
In the semiconductor industry chain, the processing link occupies a vital position and is an extremely important link.
Semiconductor processing
Semiconductor processing is the process from crystal rod to single chip. From the process classification, the front-end processing technology of semiconductor materials mainly includes crystal rod cutting, crystal rod rounding, crystal rod slicing, wafer grinding, wafer chamfering and edge grinding, and wafer thinning and polishing; the subsequent packaging process includes circuit production, polishing, back thinning and dicing, all of which are inseparable from the extensive use of diamond tools.
At present, the third-generation semiconductor materials represented by silicon carbide and gallium nitride have the advantages of high breakdown electric field, high thermal conductivity, high electron saturation rate, and strong radiation resistance, and are more suitable for high voltage and high frequency scenarios. At the same time, silicon carbide and gallium nitride are hard and difficult to process, while diamond materials and related products have become an indispensable part of the third-generation semiconductor processing process due to their superhard properties.
With the popularization of technologies such as 5G and the Internet of Things, the consumer electronics industry has an increasing demand for precision machining. Diamond tools and diamond powder products provide high-quality precision surface treatment solutions for metals, ceramics and brittle materials, promoting technological progress and industrial upgrading in the industry.
Other applications in semiconductor field
Diamond Chip Diamond is not only the hardest material in nature, but also has amazing thermal conductivity and high electron mobility. In high-frequency device applications, diamond chips can effectively overcome the “self-heating effect” to ensure that the equipment can still operate stably in high-temperature environments.
Diamond Heat Sink Diamond has become an ideal choice for heat dissipation of high-power devices due to its excellent thermal conductivity (up to 2000W/m·k, 5 times that of copper and silver) and excellent insulation properties. In high-power semiconductor lasers, the application of diamond heat sinks can significantly improve heat dissipation efficiency and reduce thermal resistance, thereby increasing the output power of the laser and extending its service life.
Electronic Packaging By compounding diamond particles with high thermal conductivity metal matrices such as Ag, Cu, and Al, the diamond/metal matrix composite material prepared has initially demonstrated its great potential in the field of electronic packaging. Especially at the moment when computing power demand is surging, diamond packaging substrates provide innovative solutions for the heat dissipation problem of high-performance chips, helping the rapid development of industries such as AI and data centers.
Optical Window Diamond optical window is an optical device used under extreme conditions and is often used in high-end military equipment such as missile seekers. Diamond, with its smallest thermal expansion coefficient and highest thermal conductivity, is one of the best materials for making such windows. Diamond optical window can effectively reduce temperature, ensure the stable operation of infrared detectors, and improve the guidance accuracy and reliability of missiles.
Quantum Technology In the field of quantum technology, the NV color center of diamond, as a natural quantum bit candidate, provides the possibility of realizing solid-state quantum computing and quantum information processing.
BDD electrode Boron-doped diamond (BDD) electrode has unique advantages in electrochemical advanced oxidation processes with its extremely wide electrochemical window, extremely high oxygen evolution potential, extremely low adsorption characteristics and excellent corrosion resistance.
Although the direct application of diamond as a chip material is still far away, it has shown great potential and value in many links of the semiconductor industry chain. From semiconductor processing to diamond heat sinks and packaging, to quantum technology and BDD electrode applications, diamond is gradually penetrating into various key areas of the semiconductor industry, promoting technological innovation and industrial upgrading.