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<\/p>\n<\/p>\n
Son y\u0131llarda fotovoltaiklerin, elektrikli ara\u00e7lar\u0131n, 5G ileti\u015fimlerin ve mobil elektroniklerin patlamas\u0131, cihaz \u0131s\u0131 da\u011f\u0131t\u0131m\u0131na y\u00f6nelik gereksinimlerin giderek artmas\u0131na neden oldu. Termal aray\u00fcz malzemesi, \u00e7e\u015fitli elektronik \u00fcr\u00fcnlerde, g\u00fc\u00e7 pillerinde, \u0131s\u0131tma elemanlar\u0131nda (g\u00fc\u00e7 t\u00fcpleri, trist\u00f6rler, elektrikli \u0131s\u0131tma y\u0131\u011f\u0131nlar\u0131 vb.) ve radyat\u00f6rlerde (\u0131s\u0131 emiciler, \u0131s\u0131 emiciler vb.) geni\u015f \u00e7apta kaplanabilen tipik bir termal iletken malzemedir. ve elektrikli ekipmanlar.<\/p>\n
1. Yeni enerji g\u00fcc\u00fc pili<\/p>\n
Yeni enerji ara\u00e7lar\u0131n\u0131n ana g\u00fc\u00e7 kayna\u011f\u0131 olan g\u00fc\u00e7 ak\u00fclerinin, seyir menzilini art\u0131rmak i\u00e7in m\u00fcmk\u00fcn oldu\u011fu kadar \u00e7ok say\u0131da ak\u00fc h\u00fccresini belirli bir alana yerle\u015ftirmesi gerekiyor. Bu, g\u00fc\u00e7 pilinde \u00e7ok s\u0131n\u0131rl\u0131 bir \u0131s\u0131 da\u011f\u0131t\u0131m alan\u0131yla sonu\u00e7lan\u0131r. Ara\u00e7 \u00e7al\u0131\u015f\u0131rken, ak\u00fc h\u00fccreleri taraf\u0131ndan \u00fcretilen \u0131s\u0131, \u0131s\u0131 yava\u015f yava\u015f k\u00fc\u00e7\u00fck bir \u0131s\u0131 da\u011f\u0131t\u0131m alan\u0131nda birikecek, bu da ak\u00fcn\u00fcn \u015farj ve de\u015farj verimlili\u011fini azaltacak ve ak\u00fcn\u00fcn g\u00fcc\u00fcn\u00fc etkileyecektir; ciddi durumlarda termal ka\u00e7a\u011fa neden olur ve sistemin g\u00fcvenli\u011fini ve \u00f6mr\u00fcn\u00fc etkiler. Bu nedenle, pil h\u00fccreleri aras\u0131nda ve ayr\u0131ca t\u00fcm pil mod\u00fcl\u00fc grubu ile \u0131s\u0131 emici plaka aras\u0131nda dolgu olu\u015fturmak i\u00e7in belirli bir termal iletkenli\u011fe sahip termal olarak iletken dolgu yap\u0131\u015ft\u0131r\u0131c\u0131s\u0131n\u0131n kullan\u0131lmas\u0131 gerekir. Yeni enerji g\u00fc\u00e7 pilleri nedeniyle, g\u00fc\u00e7 pil h\u00fccrelerinin optimum \u00e7al\u0131\u015fma s\u0131cakl\u0131\u011f\u0131 aral\u0131\u011f\u0131 \u00e7ok dard\u0131r; genellikle 20-40\u00b0C aras\u0131ndad\u0131r ve 65\u00b0C’nin alt\u0131ndad\u0131r. Arac\u0131n \u00e7al\u0131\u015fmas\u0131n\u0131n g\u00fcvenli\u011fini ve optimum ak\u00fc performans\u0131n\u0131 sa\u011flamak i\u00e7in genellikle termal iletken yap\u0131\u015ft\u0131r\u0131c\u0131ya ihtiya\u00e7 duyulur. Yap\u0131\u015ft\u0131r\u0131c\u0131n\u0131n termal iletkenli\u011fi 3W\/(m\u00b7K)’nin \u00fczerine \u00e7\u0131kar.<\/p>\n
2. Fotovoltaik invert\u00f6r<\/p>\n
Genel olarak konu\u015fursak, fotovoltaik invert\u00f6rlerin termal iletkenli\u011finin 2,0W\/mK’den az olmamas\u0131 ve dayan\u0131m voltaj\u0131n\u0131n 5kV\/mm’den az olmamas\u0131 gerekir. Ayn\u0131 zamanda kontrol devre kart\u0131n\u0131 ve bile\u015fenlerini d\u0131\u015f ortam\u0131n ve mekanik kuvvetlerin etkisinden korumak, devrenin g\u00fcvenli\u011fini ve stabilitesini korumak i\u00e7in fotovoltaik invert\u00f6rlerde kullan\u0131lan termal iletken potting tutkal\u0131n\u0131n da bulunmas\u0131 gerekir. Belirli deprem direnci, darbe direnci, toz direnci, UV direnci, su ge\u00e7irmez ve nem ge\u00e7irmez, yal\u0131t\u0131m ve di\u011fer \u00f6zellikler. Ek olarak, fotovoltaik sistemlerin \u00f6mr\u00fc genellikle yakla\u015f\u0131k 20 y\u0131l oldu\u011fundan, fotovoltaik invert\u00f6rlerde kullan\u0131lan termal iletken yap\u0131\u015ft\u0131r\u0131c\u0131lar\u0131n \u00f6m\u00fcr gereksinimleri de nispeten y\u00fcksektir, genellikle 8 y\u0131ldan fazlad\u0131r.<\/p>\n
3. 5G baz istasyonu<\/p>\n
Baz istasyonu tipik bir kapal\u0131 do\u011fal \u0131s\u0131 da\u011f\u0131tma cihaz\u0131d\u0131r. Is\u0131 da\u011f\u0131tma y\u00f6ntemi, g\u00fc\u00e7 cihaz\u0131n\u0131n \u0131s\u0131s\u0131n\u0131n \u00f6nce kasaya aktar\u0131lmas\u0131na ve daha sonra kasadan havaya iletilmesine izin vermektir. 5G baz istasyonlar\u0131ndaki elektronik ekipmanlar\u0131n i\u015fleme \u00f6zellikleri g\u00f6z \u00f6n\u00fcne al\u0131nd\u0131\u011f\u0131nda, otomasyon verimlili\u011fini art\u0131rmak amac\u0131yla in\u015faatlarda s\u0131kl\u0131kla da\u011f\u0131t\u0131m teknolojisi kullan\u0131l\u0131yor. Bu nedenle, termal olarak iletken yap\u0131\u015ft\u0131r\u0131c\u0131n\u0131n, d\u00fc\u015f\u00fck stres ve y\u00fcksek s\u0131k\u0131\u015ft\u0131rma mod\u00fcl\u00fcne sahip bir jel halinde haz\u0131rlanmas\u0131 gerekir.<\/p>\n
4. Tala\u015f paketleme, \u0131s\u0131 da\u011f\u0131l\u0131m\u0131<\/p>\n
\u0130yi reolojik \u00f6zelliklere sahip termal iletken silikon ya\u011f\u0131 esas olarak \u00e7ip ile ambalaj kabu\u011fu ve ambalaj kabu\u011fu ile \u0131s\u0131 emici aras\u0131nda dolgu yapmak i\u00e7in kullan\u0131l\u0131r. \u00c7ipin \u00e7al\u0131\u015fma s\u0131cakl\u0131\u011f\u0131 s\u0131kl\u0131kla 60-70\u00b0C’ye ula\u015ft\u0131\u011f\u0131ndan, \u00e7ipte kullan\u0131lan termal iletkenlik malzemesinin \u00e7ok y\u00fcksek termal iletkenlik gereksinimleri vard\u0131r. Y\u00fcksek, 5 W\u00b7(m\u00b7K)’nin \u00fczerinde olmas\u0131 gerekir ve d\u00fc\u015f\u00fck yap\u0131\u015fkan tabaka kal\u0131nl\u0131\u011f\u0131, y\u00fcksek esneklik, y\u00fcksek \u0131s\u0131 iletkenli\u011fi, d\u00fc\u015f\u00fck temas \u0131s\u0131l direnci ve uygun \u0131s\u0131l genle\u015fme katsay\u0131s\u0131 gibi temel \u00f6zellikler gerektirir.<\/p>\n
Ortaya \u00e7\u0131kan uygulama alanlar\u0131n\u0131n ortaya \u00e7\u0131k\u0131\u015f\u0131, art\u0131k termal iletkenli\u011fin iyile\u015ftirilmesiyle s\u0131n\u0131rl\u0131 olmayan, ancak dielektrik, yal\u0131t\u0131m, y\u00fcksek performans G\u00fcvenilirlik, alev geciktiricilik dahil olmak \u00fczere \u00e7ok i\u015flevlilik y\u00f6n\u00fcnde geli\u015fen termal aray\u00fcz malzemeleri i\u00e7in daha \u00e7e\u015fitli gereksinimleri ortaya \u00e7\u0131kard\u0131. ve di\u011fer y\u00f6nleri, \u00e7e\u015fitli alanlar\u0131n \u00f6zel ihtiya\u00e7lar\u0131na daha iyi uyum sa\u011flamak, b\u00f6ylece ilgili sekt\u00f6rlerde teknolojik ilerlemeyi ve yenili\u011fi te\u015fvik etmek.<\/p>\n","protected":false},"excerpt":{"rendered":"
Son y\u0131llarda fotovoltaiklerin, elektrikli ara\u00e7lar\u0131n, 5G ileti\u015fimlerin ve mobil elektroniklerin patlamas\u0131, cihaz \u0131s\u0131 da\u011f\u0131t\u0131m\u0131na y\u00f6nelik gereksinimlerin giderek artmas\u0131na neden oldu.<\/p>\n","protected":false},"author":7,"featured_media":130954,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[851],"tags":[],"class_list":["post-130987","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-endustri-haberleri-tr"],"acf":[],"_links":{"self":[{"href":"https:\/\/www.alpapowder.com\/tr\/wp-json\/wp\/v2\/posts\/130987","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.alpapowder.com\/tr\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.alpapowder.com\/tr\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.alpapowder.com\/tr\/wp-json\/wp\/v2\/users\/7"}],"replies":[{"embeddable":true,"href":"https:\/\/www.alpapowder.com\/tr\/wp-json\/wp\/v2\/comments?post=130987"}],"version-history":[{"count":0,"href":"https:\/\/www.alpapowder.com\/tr\/wp-json\/wp\/v2\/posts\/130987\/revisions"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.alpapowder.com\/tr\/wp-json\/wp\/v2\/media\/130954"}],"wp:attachment":[{"href":"https:\/\/www.alpapowder.com\/tr\/wp-json\/wp\/v2\/media?parent=130987"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.alpapowder.com\/tr\/wp-json\/wp\/v2\/categories?post=130987"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.alpapowder.com\/tr\/wp-json\/wp\/v2\/tags?post=130987"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}